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Silicon Sense, Inc. represents industry leading milling and processing facilities to ensure that our customers consistently receive the highest quality products.
| Design, Layout and Mask Procurement |
| Complete design, layout, tapeout and photomask making services for discretes to VLSI |
| Foundry Services |
| CMOS, Bipolar, and BiCMOS processes with digital, linear and micro-machined devices |
| Silicon Epitaxy |
| All dopants and silicon sources available for optimum films |
| Wafer diameters from 2” to 5” for both older and newer fabs |
| Diffusions, Oxides, PECVD and LPCVD Depositions |
| Boron, Antimony, Arsenic, Phosphorous diffusion and oxidation for 2” to 8” wafers |
| Si3N4, LTO, Poly, Oxy-Nitride, Sipos and special materials 2” to 8” capability |
| Photolithography and Etching |
| Positive and Negative Photoresist processing for 2” to 8” wafers |
| Wet/dry etching of all semiconductor and thin film materials |
| Ion Implantation |
| Capability from 2” to 6 ” for both mature and newer fab lines |
| Able to implant partial wafers and custom angles/orientations for R&D |
| High current capability for economical implants to 5E16 |
| Metalilzation and Thin Film Deposition |
| Al/Si/Cu and Ti/W alloys, Au, Ag, Cr also other resistive, transparent, magneto-resistive, piezoclectric and customer supplied films sputtered or evaporation with substrate bias/heat |
| DC/RF Magnetron and RF diode modes with heat/etch and up to three sequential depositions |
| Grind, Lap, Polish, and Dicing |
| Substrate preparation to SEMI standard or better for substrates 2” to 6 ” |
| Backslap/grind/polish for thinning and backside damage guttering, dicing for 2” to 8” inch |
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